Direct Copper Bonded/DBCu Substrates 
Excellent electrical insulation 
Very good thermal conductivity 
Superb thermal cycling 

·Fine Mechanical strength            

·Fine Adhesion and Corrosion Resistent

·Excellent Electrical Insulation and Thermal Conductive Properties   

·High Reliability                    

·Lower Thermal Expansion Coefficient 

·Etchable to Various Graphs          

Applications

 Power Semiconductor Modules

·Power Hybrids

·Power Control Circuits

·Solid-state Relays

·Semiconductor Refrigerators

·Electronic Devices for Automobile

·Intelligent Power Assemblies

·Solar Cell Board