J25-D3 Double Bond Head Pulse Heat Bonding Machine

J25-D3 Double Bond Head Pulse Heat Bonding Machine
Model:J25-D3
Brand:-
Origin:Made In China
Category:Electronics & Electricity / Other Electrical & Electronic
Label:Double head bonding , head bonding , LCD display repair
Price: -
Min. Order:-

Product Description

Features:

Left-right moving workbench, pulse heating, fast cooling system enhance throughput rate.
PLC system. Temperature is controlled by imported intelligent temperature controller.
Adopts strong light source , a break through of the traditional lighting technique, adaptable to production of various products.
Intelligent ergonomic interface, multi-functional program. Can store various parameter setting, provide ergonomic operation and easy.
High rigidness titanium alloy bond head ensures quality. Can maintain evenness under heavy duty from high temperature.
Control system adopts Japan IAI robotic arm, slider positioning synchronously, Platform movement accuracy is ± 0.01mm.
Emergency stop protection button and double switch buttons provide high degree of safety.
All pneumatic devices adopt Japan SMC which ensure s the equipment accuracy and durability.
Suitable for all kinds of TAB, TCP bonding and FPC, FFC, PCB soldering or solder bonding.
Specification:
Control System
LG-K 7M -DR-PLC
Operating Interface
WEIVEW Full-Color PDA
Pressure Range
1-28.2kgf
Time Range
1-100s
Throughput
350-450PCS/H
Bond Head Accuracy
± 0.01mm
Temperature Accuracy
± 2.5 Degree Celsius
Product Min Pitch
pitch ≥ 0.03mm
Product Max Size
7 inches diagonal
Alignment Min Width
10mm
CCD Magnification
70-120 X
Temperature steps
6(including start / away temperature)
Temperature rise time/ step
1-2 s/step
Power
2-3KW
Thermocouple
K Type
Weight
200KG
Dimension
(L) 1060mm × (W) 700mm × (H) 1335mm

Features:

Left-right moving workbench, pulse heating, fast cooling system enhance throughput rate.

PLC system. Temperature is controlled by imported intelligent temperature controller.

Adopts strong light source , a break through of the traditional lighting technique, adaptable to production of various products.

Intelligent ergonomic interface, multi-functional program. Can store various parameter setting, provide ergonomic operation and easy.

High rigidness titanium alloy bond head ensures quality. Can maintain evenness under heavy duty from high temperature.

Control system adopts Japan IAI robotic arm, slider positioning synchronously, Platform movement accuracy is ± 0.01mm.

Emergency stop protection button and double switch buttons provide high degree of safety.

All pneumatic devices adopt Japan SMC which ensure s the equipment accuracy and durability.

Suitable for all kinds of TAB, TCP bonding and FPC, FFC, PCB soldering or solder bonding.

Specification:

Control System

LG-K 7M -DR-PLC

Operating Interface

WEIVEW Full-Color PDA

Pressure Range

1-28.2kgf

Time Range

1-100s

Throughput

350-450PCS/H

Bond Head Accuracy

± 0.01mm

Temperature Accuracy

± 2.5 Degree Celsius

Product Min Pitch

pitch ≥ 0.03mm

Product Max Size

7 inches diagonal

Alignment Min Width

10mm

CCD Magnification

70-120 X

Temperature steps

6(including start / away temperature)

Temperature rise time/ step

1-2 s/step

Power

2-3KW

Thermocouple

K Type

Weight

200KG

Dimension

(L) 1060mm × (W) 700mm × (H) 1335mm

J25-D3 Double Bond Head Pulse Heat Bonding Machine 1

Member Information

Jacko Equipments Corporation Ltd.
Country/Region:Guang Dong - China
Business Nature:Manufacturer
Phone:31068626
Contact:Sam Wong (Manage)
Last Online:10 Aug, 2011