High-Accuracy BGA Rework Station KID-R700, best for small board like mobile phone

1.   Product profile

KID-R700 is a rework equipment with optical alignment system, and the integration of soldering and desoldering design; applicable to BGAs of all forms of encapsulation

2.    Features

²          Streamline design, beautiful and room-saving.

²          Hot air head and mounting head integration design, step motor drive, with auto soldering and desoldering functions.

²          New-style hot air and IR mixed 2 in 1 for upper head heating; temperature rises fast,   which leads to the big temperature difference between BGA and others  around with no effects on them; suitable for PCB with small pitch between components.

²          Three separate heating areas, upper/lower hot air and bottom IR; heating time and temperature can display on the touch screen.

²          Powerful cross flow fan cools down the lower heating areas quickly.

²          Color high-resolution optical vision system with split vision, zoom in and fine-adjusting functions, aberration distinguish device included, auto-focus, software operation, 22x optical zoom, reworkable BGA size range 1.5 * 1.5 mm ~70*70mm.

²          Embedded industrial computer, touch screen interface, PLC control with real-time temperature profile display; both setting profile and real temperature profile can be displayed；

²          Inbuilt vacuum pump, rotatable 60° in Φ angle, fine-adjusting mounting  suction nozzle.

²          Upper/lower heater with 8 segments of temperature up (down) and 8 segments of constant temperature control, industrial computer can save temperature profiles without limit; can analysis profiles on the touch screen. 

²          Suction nozzle can detect mounting height automatically with pressure controllable within tiny extent.

²          Many sizes of alloy nozzle, easy for replacement; can locate at all angle.

²          Color optical vision system manually operated.

²          Auto-place BGA chips on jigs with locating scales.

²         Equipped with thermocouple port, real-time temperature monitoring and      analyzing functions.

 

3.     Technical parameter

l       Style No: KID-R700

l       Max PCB size: L20*W20~L350*W350mm

l       PCB thickness: 0.5~5mm

l       Applicable BGA: 1*1~70*70mm

l       Min. ball pitch: 0.15mm

l       Max weight of BGA:  150g

l       Placement accuracy:  ±0.01mm

l       PCB locating way: Outer

l       Work table adjustable: forward/backward ±10mm, left/right±10mm

l       Temperature control way: K-type thermocouple, close loop control

l       Lower heater: IR+hot air 800W

l       Upper heater:  IR+hot air 1200W

l       Bottom preheat: IR 2700W