(CNM could provide high quality target material for the field of electrical and semiconductor devices, flat panel display , architectural and automotive glass, thin film solar cell, magnetic storage, instrument, decorate thin film, etc.)

High purity metal sputtering target material (3N-6N):

Aluminum (Al), chromium (Cr), copper (Cu), nickel (Ni), silicon (Si), germanium (Ge), niobium (Nb), titanium (Ti), indium (In), silver (Ag), tin (Sn), graphite , tantalum (Ta), molybdenum (Mo), gold (Au), hafnium (Hf), manganese (Mn), zirconium (Zr), magnesium (Mg), zinc (Zn), lead (Pb), iridium (Ir), yttrium (Y), cerium (Ce), lanthanum (La), ytterbium (Yb), gadolinium (Gd), platinum (Pt), etc..

High density ceramic target (3N-5N):

ITO , AZO , IGZO , magnesium oxide (MgO), yttrium oxide (Y2O3), iron oxide (Fe2O3), nickel oxide (Ni2O3), chromium oxide (Cr2O3), zinc oxide (ZnO), zinc sulfide (ZnS), cadmium sulfide (CdS), molybdenum disulfide (MoS2), silicon dioxide (SiO2), silicon monoxide (SiO), zirconium dioxide (ZrO2), niobium pentoxide (Nb2O5), titanium dioxide(TiO2), hafnium oxide (HfO2), titanium boride (TiB2), zirconium diboride (ZrB2), tungstic oxide (WO3), aluminum oxide (Al2O3), tantalum pentoxide (Ta2O5), magnesium fluoride (MgF2), zinc selenide (ZnSe), aluminum nitride (AlN), silicon nitride (SiN), boron nitride (BN), titanium nitride (TiN), silicon carbide (SiC), lithium niobate (LiNbO3), praseodymium titanate (PrTiO3), barium titanate (BaTiO3), lanthanum titanate (LaTiO3), and so on..

Note:The ceramic target produced in CNM adopts the most advanced ceramic production technology—inert gas protection hot isostatic pressing sintering technology, the relative density is grater than 95-99%. In addition, CNM could provide with the metalizing process of the target and unbounded services.

High purity alloy sputtering target:nickel-vanadium alloy (Ni-V), nickel-chromium (Ni-Cr), titanium-aluminum alloy (Ti-Al), silicon-aluminum alloy (Si-Al), copper-indium alloy (Cu-In), copper-gallium alloy (Cu-Ga), copper-indium-gallium alloy (Cu-In-Ga), copper-indium-gallium-selenium alloy (Cu-In-Ga-Se), stainless steel , zinc-aluminum alloy (Zn-Al), tungsten-titanium alloy (W-Ti), iron-cobalt alloy (Fe-Co), etc.

Note: CNM product high purity alloy sputtering target: tiny grain size number (150-60um), high relative density (99-99.9%), high purity (99.9-99.999%). 

In addition, CNM provides with the metalizing process of the target materials and unbounded services.