Model Features

New generation of laser scribing machine DR-HP50 has got CE certification. It is mainly used for scribing and cutting in electronics industry and solar cells, ceramic substrate, thin metal films and a variety of silicon semiconductor industry and solar industry. The device is designed by experts, having the following prominent features: high beam quality, stable power, precision CNC table and efficient automatic cooling unit. Some of the most important parts are produced in the United Kingdom, the United States and Germany. It results in higher production efficiency as the whole automatic control system, easy operation and low maintenance.

 

This machine uses Nd: YAG laser (laser wavelength: 1064nm, laser power: 50W), cruciform working table, duplex vacuum suction cups and the specific control software developed by our company. The Performance and price ratio is high. At this time, it is the most popular and most practical models in the market of solar silicon scribing

 

Applicable materials and industries

1) Scribing of monocrystalline silicon, polycrystalline silicon solar films and silicon cell in the solar industry;

2) It can also cut a variety of fragile items, and a number of flexible sheets of metal and non-metallic slices.

 

Application:

 

The scribing of monocrystalline silicon, polycrystalline silicon, amorphous silicon solar cells; cutting of ceramic, diamond; scribing of silicon, germanium, gallium arsenide and semiconductor substrates, semiconductor devices and alumina ceramic substrate in integrated circuits (such as ceramic substrates); precision cutting, drilling of thin metal template, cutting of the template of SMT placement machine. They are used for scribing and cutting in electronic industry, and solar cells, ceramic substrate, thin metal sheets and various silicon in semiconductor and solar industry.

 

Equipment features

 

· Excellent beam quality and reliable system

 

· Up to 120 mm/s in the scribing speed, low defect rate

 

· Automatic cooling unit

 

·Precise CNC working table

 

· Friendly interface and simple software operation

 

Technical index:

Laser working material: Nd3 +: YAG

 

Laser wavelength: 1064 nm

 

Pump light: krypton lamp

 

Cavity: ceramic cavity

 

Modulation frequency: 0.5-50 kHz

 

Average laser power: adjustable, maximum 50 W

 

Collimated light: red laser

 

Dicing speed: adjustable, maximum 120mm / s

 

Dicing depth: maximum 1.2mm

 

Dicing line width: minimum 0.02 mm

 

Bench repeat positioning accuracy: 0.01mm

 

Table travel: 300 mm × 300 mm

 

Rated input voltage: three-phase four-wire AC 380V ± 10%, 50 Hz / 60 Hz, with a protected ground wire (such as voltage fluctuation is too large to be equipped with voltage regulator)

 

Maximum input power: 5 kW

 

Size: 550 mm × 290 mm × 650 mm

 

Net weight: about 560 kg

 

Cooling method: Water-cooled

 

Standard equipments

Laser: 1 set

 

Centrifugal fan: 1 set

 

Vacuum pump: 1 set

 

Cooling unit (cooler, temperature controller, water tank, and filter): 1 set

 

Bench unit (CNC): 1 set

 

Krypton lamp: 2

 

Laser conversion film: 1 set

 

Computer: 1 set

 

Scribing software: 1 set

Operation Manual: 1 set