Detailed Product Description

laptop BGA rework
* with movable heaters, equipped with different alloy nozzles
* with alarming protection function and vacuum

Laptop BGA Rework---- SP360C

Specification:

Applicable PCB size

Max PCB size: 430mmX350mm

Applicable BGA size

Max size: 55mmX55mm

Min size: 7mmX7mm

Max weight: 80g

Power for operation: 3600W

Main heater: 800W

Lower heater: 800W

Bottom heater: 2000W

 

Machine dimension: 650mm*500mm*600mm

Machine weight: 36KG

Input power: AC 220V 3.6KW
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Description

* High quality heating material produces high-tem breeze, precisely controlling the soldering and desoldering process.

* Movable heating head, able to move horizontally; easy to operate;

* Embedded industrial computer, touch screen interface, PLC control; real-time temperature curve display, able to display set curve and practically-tested curve; 7.2 high definition screen, convenient for operation and observation;

* Industrial computer able to store unlimited temperature curves, curve analysis can be done on touch screen; both English and Chinese can be input;

* The temperatures of the upper and lower heater can be precisely controlled according to set temperatures; bottom constant temperature infrared heating area; appropriate temperature control apparatus can ensure safe rework for BGA;

* The BGA soldering supporting frame can micro-adjusted to avoid local sinkage;

* Powerful cross flow can cool the lower heating area;

* The adjustable PCB positioning supports, easy and fast to install PCB; special fixture for installing allotype boards ;

* with sound alarming function after finishing soldering or desoldering; hand vacuum pen easy for picking up BGA;

* Set with over temperature alarming and protection function;

* Equipped with different hot gas nozzles, easy to replace; can be customized according to specific needs;

* The integrated design of machine and chassis is room-saving.