| Item |
Mass processing capability |
Small batch processing capability |
| Layer (Max.) |
2-22 |
24-28 |
| Type of the board material |
FR-4, high-TG , aluminum?base, Rogers, etc., F4, BT |
PTFE，PPO ，PPE , |
| Rogers,etc |
E-65，ect |
| Compound pressed board |
4 layers 6 layers |
6 layers 8 layers(FR-4+Rogers) |
| Maximum Size |
400mm X 700mm |
500mm X 1000mm?? |
| Outline Size Tolerance |
±0.13mm |
±0.10mm |
| V-CUT Deepness Tolerance |
+/- 0.15 mm (V-CUT) ：+/- 0.1 mm (CNC V-CUT) |
| BoardThicknessRange |
0.1mm--6.0mm |
7.0--8.0mm |
| Board Thickness Tolerance( t≥0.8mm) |
±8% |
±5% |
| Board Thickness Tolerance (t＜0.8mm) |
±10% |
±8% |
| Medium Thickness(Min) |
0.065mm(RCC) |
0.05mm |
| Minimum Line Width |
0.075mm（3mil） |
0.063mm(2.5mil) |
| Minimum Line Distance |
0.075mm（3mil） |
0.063mm(2.5mil) |
| Line Margin |
0.2 mm（CNC） ：0.30 mm (punch)：0.50 mm (V-CUT) |
| Outer layer copper thickness |
9um--140um |
175um--210um |
| Inner layer copper thickness |
9um--140um |
175um--210um |
| Drill hole size (mechanical hole) |
0.25mm--6.00mm |
0.15mm--0.25mm |
| Finish Hole size (mechanical hole) |
0.10mm--6.00mm |
0.05mm--0.1mm |
| Hole size tolerance (mechanical hole) |
+/- 0.076 mm (normal hole) +/- 0.05 mm (fit-press hole) +0.1/-0.05 mm (punch hole) |
| Hole position deviation (mechanical hole) |
+/-0.075mm: (drill hole) : +/- 0.10 mm (punch hole) |
0.050mm |
| Laser hole size |
0.10mm (1+n+1;2+n+2) |
0.075mm |
| Aspect Ratio |
10:1 (drill hole size>0.2mm) |
12:1(drill hole size>0.25mm) |
| Solder mask type |
sensitive green, yellow, black, MATT, blue, red ink,and peelable blue glue. |
| Minimum width of solder mask bridge |
0.10mm |
0.075mm |
| Minimum size of solder mask separation ring |
0.05mm |
0.025mm |
| Soldermask oil? plug hole diameter |
0.25mm--0.60mm |
0.6mm-0.70mm |
| Impedance tolerance |
±10% (impedance>50ohm);±5ohm(impedance<50ohm) |
±5% (impedance>50ohm) |
| Surface processing type |
HAL, plating nickel gold(soft gold/flash gold), thick & hard gold, chemical nickel gold,immersion tin,lead-free H.A.S.L, Entek,gold-finger,and selective surface processing. |
