FEATURES

1. End stackable for standard 0.1integrated circuit pitch

2. Molded 0.3” integrated circuit packing outline allowing automatic reflow wave soldering

3. Smaller size makes better heat convection during PC board reflow wave soldering

4. Top tape sealed to withstand wave soldering, board washing

5. All plastics are UL 94-0 grade fire retardant

6. Twin contacts designed to ensure stable contact

7. Gold plated contact to ensure low contact resistance and Tin plated terminals to prevent contamination during soldering

APPLICATION

1. Numerical setting for computer terminal equipment

2. Price setting for vending machines

3. Programming for game machines

4. Programming for industrial equipment and measuring instruments