㈠：Two independent heating zones, multitude temperature   zones control, lead free process.

㈡：Top heating zone use to infrared

㈢：The bottom zone applies to far infrared to pre-heating to prevent PCB curve

㈣：Six-section temperature controls, simulates re-flower effect completely.

㈤：Cooling PCB after heating, to prevent PCB deformation

㈥：BGA welding on completion of the demolition, a voice prompt

㈦：Vacuum wand sucks BGA, convenient, reliable and durable

㈧：Card board with a special tooling for a wide variety of notebook motherboard(option )

㈨：COM connection, connect with computer to achieve hi-end rework function

【Product Model: RE7500】 parameter table