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LED patch sealant

Model:HT-3635A/B
Brand:And the day
Origin:Made In China
Category:Chemicals / Adhesives & Sealants
Label: -
Price: -
Min. Order:10 pc
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Detail

Product Description

Product Name: double group LED adhesive
Product model: HT-3635A/B
Product features:
High refractive index, high transmittance, high brightness
- good resistance to moisture permeability
- special 3D anti settling, excellent uniformity of color temperature
Excellent electrical insulation properties
- resistance to heat and cold shock, water, not into the red ink
- high strength adhesive, suitable for LED SMD chip package
Curing process
Curing, curing, no by-product precipitation.
- the platinum catalyzed hydrosilylation process
- addition reaction (double group)
Characteristics after curing
- low permeability and oxygen permeability
High optical transparency
- thermal stability
1, application scope
This product is high purity of two-component thermosetting type phenyl silicone resin materials. Products refraction rate is high, with shrinkage of small, light transmission rate is high >93%, and PPA, metal and chip and firm adhesion characteristics is mainly used in the manufacture of LED, chip protection and micro connecting lines from being damaged by the outside world, resistance to the environment pollution, moisture, shock, vibration and other effects, can maintain the stability of their optical properties, mechanical properties and electrical properties in a wide range of temperature, humidity and harsh environmental conditions. Low permeability oxygen permeability package barrier LED lamp bead the sulfidation resistance.
2, typical physical properties
Project
Numerical
Non curing property
Appearance
Transparent liquid
Group A 25 (mPa.s)
7500
Group B 25 (mPa.s)
2100
Mixed 25 (mPa.s)
3800
Condition of use
Mixed proportion (weight ratio) A:B = 1:2
Post curing characteristics
Hardness
D. 55shore
Use temperature
50 ~ 250 C
Refractive index
More than 1 535
Transmittance% (wavelength 3mm 450nm thickness)
> 93
Volume resistivity (CM)
> 1 * 1014
Dielectric constant
3 (60Hz)
Volume expansion coefficient
235PPM
Breakdown voltage
20 ~ 25Kv/mm
Ion content ppm
Na+
<0.2
K+
<0.6
Cl-
<0.5
3, the use of instructions
3.1 the substrate surface should be clean and dry. It can be heated to remove the moisture on the surface of the substrate; using naphtha, methyl ethyl ketoxime (MEK) or other suitable solvents to clean the substrate surface should not be use to the substrate in a dissolution or corrosion of the solvent, should not use the residual solvent.
3.2 in accordance with the recommended mix proportion - A:B = 1:2 (weight ratio), accurate weighing to clean glass containers, and fully mixed with the use of high speed mixing equipment, high speed mixing heat generated may make the temperature rise, thereby reducing the use of time.
3.3 the 10mmhg vacuum extrusion bubble. Before dispensing package material extrusion bubble. According to the need in the post allocation can also increase the bubble removal procedures.
3.4 to ensure the operability of the compound, A, B mix, please run out in 120 minutes.
3.5 curing conditions:
Heat to 90 degrees, bake for about 90 minutes, and then heat to 150 degrees, 180 minutes of baking.
4, product packaging
4.1 this product is divided into A, B double group of packaging.
4.2 the product is made of plastic or glass bottle packaging, specifications for the 500 grams per bottle packaging, a set of 1500 grams.
4.3 this product packaging marked name, brand name, batch number, weight, manufacturer, date of manufacture etc..
5, storage quality
5.1 this product please keep in the room temperature, avoids the sunlight, the ventilation is dry.
5.2 not used up the product should be re sealed to save, it is recommended to put into the glass drying box.
5.3 the preservation period of the product is 6 months from the date of making the home.
6, note
6.1 it is forbidden to mix B A into the bottle, because of the small amount of B glue can cause the phenomenon of A glue and knot!
6.2: certain materials, chemical agents, curing agents, and plasticizer can inhibit the curing of elastomeric materials:
1, organic tin and other organic metal compounds
2, sulfur, polysulfide, polysulfones or other sulfur containing items
3, amine, polyurethane rubber or containing ammonia
4, sub phosphorus or phosphorus containing items
5, some flux residues
If there is doubt about whether a certain type of substrate or material will inhibit the curing, it is s ested that a compatibility test should be done to test the suitability of a specific application. If there is a doubt that the substrate and the interface between the elastomer material is not compatible, it will inhibit the curing.
The above performance data is the typical data measured in the laboratory environment of the temperature 25, humidity 70%, only for the use of the reference, and can not guarantee the full data in a specific environment, please customers in the use of experimental data as the standard.


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LED patch sealant 1
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LED patch sealant 2
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Send Inquiry to this Member

Dongguan city and new material limited company

Zhenhua Road, Dongguan City Southern Industrial Estate B first floor two

Phone:
86-0769-88966661
Fax:
86-0769-88962111
Contact:
Liu Tao (Electronic commerce)
Mobile:
13922932705

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