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High Tg Glass/Epoxy Tape


Properties

Excellent in wire-bonding workability with excellent hot hardness.
Excellent in adhesion to copper foil or to adhesive agent
Excellent in insulation resistance.
Excellent in chemical resistance
Low temp. curable (Max.160C )
Compared with PI film,Excellent in demensional stability with proper stiffness

Applications

IC substrate for Smart cards
IC substrate for BGA , CSP or COB
Small size LCD driver substrate