main focus on semiconductor manufacturing area including front-end, and back-end. main biz including:
1) OEM spare parts covering back-end whole IC manufacturing process machine
wafer mount, wafer saw, die attach, wire bonding, molding, plating and testing & packing.
2) Tools: sawing blade, bonding tools, capillary, capillary screw, wire guide, testing finger, rubber tip , nozzle, etc.
3) Indirect materials: ESD container, clean-room smocks, clean-room clothes etc.
4) Technical Support: design & machine retrofit, motor driver maintenance, all control board maintenace etc.