Item

Capalitily

1.Layer

1-18

2.Basic Material

CEM-3,FR-4,CEM-1

3.Board Thickness

0.2mm-3.2mm (8mil-126mil)

4.Min Thickness of Core Board

0.1mm(4mil)

5.Copper Thickness

Min:1/3 oz ; Max:3 oz

6.Min Trace Width/Space

0.075mm(3mil)

7.Min Diameter of Drilling Hole

0.25mm(10mil)

8.Min Diameter of Punched Hole

0.9mm(35mil)

9.Tolerance 

Position of Drilled Hole

±0.075mm(3mil

Trace Width

±0.05mm(2mil)

Aperture

PTH±0.075mm(3mil)

NPTH±0.05mm(2mil

Outline Tolerance

Drilling: ±0.13mm(6mil)

Warpage

>0.7

10.Surface Treatment

Gold,Plating/Immersion Gold/HAL/HAL lead-free/Immersion Silver/Entek

1I.nsulation Resistance

10KΩ-20MΩ

12.Conduction Resistance

< 50Ω

13.Testing Voltage

300V

14.V-CUT

Min:110×100mm

Max:660×600mm

Board Thickness

Min:0.6mm(24mil)

Reserved Thickness

Min:0.3mm(12mil)

Tolerance

±0.1mm(4mil)

Slot Width

Max:0.50mm(20mil)

Slot to Slot

Min:10mm

Slot to Trace

Min:0.50mm(20mil)

15.Slot

Slot size:tol.>=2W(tolerance)

PTH L:±0.15mm(6mil)

W:±0.1mm(4mil)

NPTH L:±0.125mm(5mil)
W:±0.1mm(4mil)

16.Min Hole Pad

PTH :0.13mm(5mil)

NPTH :0.18(7mil)

17.Multilayer Board

Psition of hole

0.075mm(3mil)

Deviation between Layers

4 layers: Max 0.15mm(6mil)

6 layers: Max 0.025mm(6mil)

Min insulation hole pad in inner layer

0.025mm(10mil)

Min Distance from Board Edge to Inner Roundess

0.25mm(10mil)

Board Thickness

6 layers:±0.15mm(6mil)