Model: | H-3318 |
---|---|
Brand: | HSF |
Origin: | Made In China |
Category: | Electronics & Electricity / Electronic Components / Circuit Board |
Label: | multilayer pcb , pcb manufacturing , assembled pcb board |
Price: |
¥0.15
/ pc
|
Min. Order: | 100 pc |
Multilayer PCB board
Specification:
1.Factory Price
2.Certification:UL, ISO9001,SGS,IPC
3.Prompt delivery
4.High quality
5.Good wills with our clients
Shenzhen Factory PCB assembly & PCBA assembly OEM service for Electronics Field
Applications: Computer PCBA, network card &communication card /pcb assembly
-Small orders can be accepted
- Experienced Technical Staff
- Competitive Price
- Product Features
- Customized Service
- Small Order Accepted
- Quality Approval
Item |
Capalitily |
||
1.Layer |
1-18 |
||
2.Basic Material |
CEM-3,FR-4,CEM-1 |
||
3.Board Thickness |
0.2mm-3.2mm (8mil-126mil) |
||
4.Min Thickness of Core Board |
0.1mm(4mil) |
||
5.Copper Thickness |
Min:1/3 oz ; Max:3 oz |
||
6.Min Trace Width/Space |
0.075mm(3mil) |
||
7.Min Diameter of Drilling Hole |
0.25mm(10mil) |
||
8.Min Diameter of Punched Hole |
0.9mm(35mil) |
||
9.Tolerance |
Position of Drilled Hole |
±0.075mm(3mil |
|
Trace Width |
±0.05mm(2mil) |
||
Aperture |
PTH±0.075mm(3mil)
|
||
Outline Tolerance |
Drilling: ±0.13mm(6mil) |
||
Warpage |
>0.7 |
||
10.Surface Treatment |
Gold,Plating/Immersion Gold/HAL/HAL lead-free/Immersion Silver/Entek |
||
1I.nsulation Resistance |
10KΩ-20MΩ |
||
12.Conduction Resistance |
< 50Ω |
||
13.Testing Voltage |
300V |
||
14.V-CUT |
|
Min:110×100mm Max:660×600mm |
|
Board Thickness |
Min:0.6mm(24mil) |
||
Reserved Thickness |
Min:0.3mm(12mil) |
||
Tolerance |
±0.1mm(4mil) |
||
Slot Width |
Max:0.50mm(20mil) |
||
Slot to Slot |
Min:10mm |
||
Slot to Trace |
Min:0.50mm(20mil) |
||
15.Slot |
Slot size:tol.>=2W(tolerance) |
PTH L:±0.15mm(6mil) W:±0.1mm(4mil) |
|
NPTH L:±0.125mm(5mil)
|
|||
16.Min Hole Pad |
PTH :0.13mm(5mil) |
||
NPTH :0.18(7mil) |
|||
17.Multilayer Board |
Psition of hole |
0.075mm(3mil) |
|
Deviation between Layers |
4 layers: Max 0.15mm(6mil) |
||
6 layers: Max 0.025mm(6mil) |
|||
Min insulation hole pad in inner layer |
0.025mm(10mil) |
||
Min Distance from Board Edge to Inner Roundess |
0.25mm(10mil) |
||
Board Thickness |
6 layers:±0.15mm(6mil) |
||
Characteristic Impedance |
60 Ω±10% |
Shenzhen HSF Electronic Co.,Ltd | |
---|---|
Country/Region: | Guang Dong - China |
Business Nature: | Manufacturer |
Phone: | 15814609401 |
Contact: | liko (sales) |
Last Online: | 29 May, 2012 |