This product is a solvent-free epoxy resin glue. The mixture of low viscosity, good impregnation is suitable for impregnation of coils, capacitors within the encapsulating. Having a longer time can be used, the cured product excellent electrical properties, mechanical properties. Can be designed according to user requirements into heat-resistant grade of A, E, B, F, H, C, and different products.

 

 

Appearance and characteristics: A B

Viscosity (40 ° C Cps) 175 - 250 20-30

Light yellow and light yellow

 

First, the mixing ratio: A: B = 100:80

Second, the curing conditions: 100 ° C - 110 ° C × 1 hour

, You can use time: 2 days (at room temperature)

Fourth, the use of technology: A and B in accordance with the proportion of mixed, and then the workpiece is immersed in the paint; if the conditions can be vacuum dipping, so better.

Fifth, the curing characteristics:

Compressive Strength kg/mm2 11

Tensile strength kg/mm2 6

Water absorption 25 ° C% <0.011

Withstanding voltage kv / mm> 20

Surface resistivity Ω 4.8 × 1015

Volume resistivity (Ωcm 2.2 × 1016)

A dielectric constant of 3.8

Dielectric loss tangent 1KHz 8.2 × 10-3

 

Six, the storage period: 6 months