Specifications:

1.Printed Circuit Board Fabricate/Assembly
2.safety&environmental
3.Competitive Price,High Quality
4.OEM Circuit Assembly

Product descriptions:

type:BGA assembly 

layer:8 layer
copper:1.5/1/1/1.5oz
technics:ENIG 1-3u"
ISO9001:2008;UL

8 layer FR4 BGA pcb assembly

Layers: 1-20 layer

Material:FR4,CEM-1,CEM-3,High TG150-170,Aluminum

Board thickness: 0.2-5mm
Copper: 0.5-3oz
Min holes:0.2mm for drill

Min line/space:4mil/4mil

Sloder mask:Green, Red, White, Yellow, Black, Blue,Mat Green...

Silkscreen: White, Yellow, Black, Red

Surface finish:HAL/HAL Leedfree,ENIG,Plating gold,Chem Tin/Ag,OSP

Outline Profile:CNC routing/V-Cut/Belveling/Punching

100% E-test: Flying probe test, Fixing test

Customed our products based on your need:material,specification,etc.

Welcome To K.F PCB Factory

We are professional PCB manufacturer with ten years experiences .

Products range-single, double side ,multi-layer PCB ,flexible PCB and MCPCB.

We can provide fast prototype service – S/S in 24hrs , 4-8layers in 48-96 working

hrs production time .

1.PCB Made Ability:

 

Item			Technical Standards
Rise			1-20 Layer
Material			FR-4,CEM-1,CEM-3,Hight TG,FR4 Halogen Free,FR-1,FR-2,Aluminum
Thickness			0.2mm-3.2mm(8mil-126mil)
Minimum thickness			0.075mm(3mil)
Cu			1/2 oz min;5 oz max
Min line width/spacing			0.075mm/0.1mm(3mil/4mil)
Min drill hole			0.2mm(8mil)
Punching the smallest aperture			0.9mm(35mil)
Surface finish/treatment			HALS/HALS lead free,Chemical tin,Chemical Gold,Immersion gold Inmersion Silver/Gold,Osp,Gold Plating
The largest size puzzle			610mm×508mm
Tolerance		Pore spaces	+/-0.075mm(3mil) CNC Driling
		Line width	+/-0.05mm(2mil) or
			+/-20% of original artwork
		Aperture	PTH L:+/-0.075mm(3mil)
			Non-PTH L:+/-0.05mm(2mil)
		Appearance Tolerance	+/-0.125mm(5mil) CNC Routing
			+/-0.15mm(6mil) by Punching
		Warp	0.70%
Insulation Resistance			10Kohm-20Mohm
Conduction Resistance			<50ohm
Test voltage			10-300V
MLB	Interlaminar deviation		4 layers:0.15mm(6mil)max
			6 layers:0.25mm(10mil)max

 

2.Detailed Terms for Pcb Assembly

Technical Requirement:

1) Professional Surface-mounting and Through-hole soldering Technology

2) Various sizes like 1206,0805,0603 components SMT technology

3) ICT(In Circuit Test),FCT(Functional Circuit Test) technology.

4) PCB Assembly With UL,CE,FCC,Rohs Approval

5) Nitrogen gas reflow soldering technology for SMT.

6) High Standard SMT&Solder Assembly Line

7) High density interconnected board placement technology capacity.

Production Requirement:

1) Gerber file and Bom list

2) PNP Files,clear pics needed for pcba

3) Testing method for products

Packaging & Delivery

Packaging Details:	Vacuum sealed packaging,Silica Gel inside,carton outside package
Delivery Detail:	Lead time according to order volum&board specifications