Power supply:AC 220V/50-60HZ 

Heating Method:Two-side infrared heating

Demension:Lmm360*Wmm520*H430mm

Maximum Power:2.3KW

PCB size:405mm*310mm

Heating controlled independently:Yes

Upper heating control method:High-precision closed-loop control, instrument error ±0.5%

Upper temperature control and measuring method:High sensitivity temperature sensor, temperature monitoring indirectly.(monitor temperature of heater element)

Bottom heating control method:High-precision closed-loop control, instrument error ±0.5%

Bottom temperature control and measuring method:High sensitivity temperature sensor, temperature monitoring indirectly. (monitor temperature of heater element)

Application type:Be suitable for welding,sealing-off or repairing BGA,PBGA,CSP on different PCB and more kinds of encapsulation mode component, all suitable for lead or lead-free soldering.

Suitable chip size:≤50mm

Standby Protection:Yes

Auxiliary lighting :Yes

CF160 BGA rework station adopts integrated design. On the basis of guarantee the success rate of welding, reduce machine size, it can be operated flexibly and rapidly under narrow operating environment. Random with independent stand, it’s easy to make the preparation before welding. Upper and bottom heating adopts patent temperature control technique, we have applied for national patent and counterfeit will be sued!

Features:

In the continuous exploration and practice, we make clear our R&D policy gradually, and we think that BGA rework machine required by users should equipped with below four characteristics:

1.High success rate: high success rate of welding can reduce user's cost, otherwise low success rate will increase user's loss greatly, which is very important for maintenance industry.

2.High reliability: high reliability is the direct guarantee of high success rate and it can reduce manipulation strength greatly at the same time, users mastered repair equipment characteristic can not to stay by machine during welding, otherwise users will waste a lot of valuable time and it's difficult to guarantee the success rate because of low reliability. 

3.Easy to operate: it can make users master of operation method as soon as possible and save operation time directly, thus improving working efficiency.

4.Applicability: due to the type and size of electronic components with BGA packaging technique are various and will be more and more kinds, PCB board's size and quality are different greatly, so the applicability is necessary. If machine's range of application is narrow, then it will be hard to meet the requirements of electronic products rapid development.

All of models of machine having been produced by our company at present, the success rate,reliability and other areas have been widely recognized by users, and with the development of production in the future, we will study user's feedback carefully and never stop improving our product, so that it can meet more user's requirements.

Warranty Policy:

1.We guarantee 1 year of warranty for all machine parts.

2.We can pay all the freight during warranty time (only to the clients in inland, China. The international freight should be responsible by clients).

3.We can send you a good repairable part first during warranty time, after clients repairing, then send the broken part to us.