We can manually apply our ICP directly on any Wafer box, cassettes, FOUP, and FOSB. As a result, the treated wafer FOUP and FOSB will have a surface resistance between 10^5 and 10^7 ohm. This clear coating of ICP will bring ESD properties on every part of your wafer box for a complete protection against electrostatic build up and tribocharging. Our unique ESD layer is resistant to water and common solvents such as alcohols and IPA so that you can clean and use them in cleanroom and other ESD protected areas. Our proprietary ESD layer contains no carbon black or CNTs. If you can send us your existing wafer FOUP and FOSB to us, we will hand deposit ESD layer and make them completely ESD safe.

ESD safe wafer FOUP
ESD safe wafer FOSB
ESD safe single wafer box
ESD safe IC testing Change Kit
ESD Safe Wafer Carrier Cassette Box
ESD Safe Probe Card Carrier Box
ESD Safe Photo Mask Carrier Box
ESD Safe Wafer Soldering Tray
ESD Safe Single Wafer Blister Pack
ESD Safe Wafer Positioning Tool

If you need custom service on any wafer-related processing needs, please email us for further information.

S.R.=1.0e5~1.0e9 ohms

Decay time: Less than 2 sec

Static voltage: Less than or equal 30 V