Product Features
Fast removal of residual photoresist on the wafer, the wafer surface to clean, etch rates with the highest industry.

Features
．Extremely high plasma uniformity.
．No substrate damage by using low energy ions.
．No contamination of substrates and electrodes.
．Special plasma electrode design.
．High density plasma source.
   ※ High efficiency plasma.
   ※ Combined chemical reactions and physical bombardments.
   ※ Well-controlled low ion energy.
．High cleaning efficiency.
．Wide operating condition.
．Multiple processing gases selectivity for surface cleaning and treatment.
．Fully automatic and user friendly.
．High reliability and easy maintenance.
．Customization.

Application Industry
．Removal of residual photoresist.
．Blue film residue removal.
．PSS cleaning process incoming.