FOG/FOB bonding machines，
bonding equipment，
bonding machine，
FOB bonding machine，
bonder machine，
bonder equipment，
hot press machine，
hot press equipment，
hot pressing equipment，
hot pressing machine，


1. About the application field of FOG/FOB bonding equipment XCM71 - A5
FOG / FOB bonding equipment is widely used in a variety of LCD and the large size of display panel's production and maintenance; such as， television (TV), laptop computers (NOTE BOOK), liquid crystal display (MONITOR), Tablet PC (PAD ), LCD / LCM production enterprises.

2.About the basic parameters of FOG/FOB bonding equipment XCM71 -A5
Input Power， AC220V 50-60Hz
Working pressure ，0.4-0 .8 Mpa
Operating modes， 7-inch HMI
Dimensions， L2210 × W1730 × H1500 mm
The method of Heating， heating or pulse heating thermostat
The quantity of Fixture， 2 group X-Y-θ micrometer adjustable
Range of Temperature ， RT-500
Control program， PLC controller
Body main material， Steel + baking varnish
The thermocouple， K type

3.About the functions and characteristics of the FOG/FOB bonding equipment XCM71 - A5
3.1use pneumatic components of Japan SMC and high-precision the moving parts
3.2 use temperature controller of Japan and The function module of the integral PID self-tuning temperature,accurate temperature.
3.3 Imported PLC control，the operation of 7-inch full-color touch-screen
3.4SUNSOM the elimination structure of double-cylinder deadweight, accurate pressure.