COG bonding machine XCG93-C1,
bonding machines ,
bonding machine,
COG bonding machines ,
COG bonder machine ,
COG bonder machines,


1.About the application field of COG bonding machine XCG93-C1(the pressure)，
COG bonding equipment (the pressure) is widely used in a variety of LCD display (LCD), modules (LCM) and large-sized display panel production, assembly, maintenance, production enterprises; such as， mobile phones, laptops, LCD monitors, tablet PCs, LCD / LCM production, assembly, repair enterprises.
2.Basic parameters of XCQ77-A1
Input Power， AC220V 50-60HZ
Vacuum control， vacuum + vacuum generator;
Dimensions， L1000 * W1050 * H1475mm (excluding warning lights)
Operating modes， 7-inch HMI
Control system (LG-LS)， a programmable processor
Pressure gauge， KITA, the number of explicit
Pressure regulator， Japan SMC, precision pressure regulating valve
Pressure accuracy， ± 0.5% full in the degree
Sensitivity， 0.2% full in the degree
Pressure Unit， Kg / N / Mpa / Kpa swap
counterpoint mode， CCD next counterpoint
Platform Work， Fixed
Platform Material， high quality Bakelite
Heating， heating thermostat
Thermocouple， K type
Blade material， 440C
Temperature range， RT-500

3.About the functions and characteristics of COG bonding machine XCG93-C1(the pressure)，
3.1 heating curve with digital temperature display synchronization.
3.2 can store 500 groups of function parameters.
3.3 thermocouple output parameters can be adjusted according to the head power.
3.4 SUNSOM twin eliminate structural weight, pressure accurate.