TP300 Laptop Thermal pads are the ideal and user-friendly alternative to mica in combination with thermal paste forheat dissipation and electrical insulation. Thermal conductivity of silicone is enhanced by the insertion of highly thermally conductive ceramics like boron nitride, aluminium oxide, or aluminium nitride into the polymeric structure of the elastomer. When pressure is applied, the material's softness allows it to actively cover contact surfaces, expelling air pockets and minimizing thermal contact resistance (and consequently, total thermal transfer resistance). For mechanical stability, the interface material is reinforced with fiberglass or polyimide.​

Features Applications Designed Size Offered
.Thermal conductivity: 3.0W/M-K . Power supply .Customized die cutting
. Electrically isolating . LED light
. High reliability . LCD-TV/PDP
. Easy handling . Router
. Low volatile material . Digital TV box
. REACH, RoHS & UL compliant . Solar Panel
. Others
Part Number Coding Rules:
Example:TP300-H30-T05/G-FG-M1
Description:
TP300: Thermal conductivity is 3.0W/MK.
H30: Hardness degree is 30 degrees. Producing range of hardness is 10-40°C.
T05: Thickness is 0.5 mm. Producing range of thickness is 0.3-14.0 mm
G: Gray color. BK: Black color.
FG: Fiberglass reinforced.
M1: Single-side adhesive. M2: Double-sides adhesive.