SEAYU® One component epoxy adhesive SE8307 is a kind of heat cured adhesive. It designed for stencil printing . High bonding strength,high humidity -intensity,e xcellent electrical performance and g ood storage stability.

Typical Usage
Mainly used for the bonding of the mounted components on SMT.

Properties Uncured
                                              Typical Value                           Range                                     Test Standard
Appearance                             Red cream
Chemical Type                         Epoxy Resin
Viscosity (Pa.s) (Brookfield RV)
Spindle 7                                                                             500-800                                     GB/T 2794-1995
Thixotropic index                         5.6
Density (g/cm3)                           1.35                                 1.55-1.65                                   GB/T 13354-1992
Operate Time at Room Temperature
( day @25 °C )                            14

Curing Condition Recommended

90-120s at 120 °C .
60-90s at 150 °C

The product will obtain to higher bonding strength when higher curing temperature and longer cured time . the f igure curve is the recommended curing temperature and heating rate, Underthe corresponding temperature , components need the time when they achieve good bonding strength .

Performance After Cured
( Cured for 30min@150 °C )

Physical Property                                            Typical Value                                       Test Standard
Hardness ( Shore D)                                                81                                              GB/T 2411-1980
Shear Strength ( MPa )                                           14.8                                            GB/T 7124-1986
Tg ( °C )( DSC )                                                     98                                                ASTM E1545
Dielectric strength (KV/mm)                                   27.5                                             GB /T 40 8.1 - 1999
S urface resistance ( Ω )                                     3.4 × 10(16)                                    GB /T 1410- 2006
Heat strength
(30min at 150 °C )

Shear Strength ( MPa ) AL-AL

Direction For Use
The product should be recovered to room temperature before use, don't open the aluminum
foil package before recovered to room temperature(the recovering time of 300ml packaging
at least 2-4 hours).
The product should be used at 25 °C , < 60% Rh .
T he glue viscosity will decline under t he higher temperature, which influence printing
effect; High h umidity can increase the glue of moisture absorption which shorten the opening
hours of the glue and influence the glue bonding strength. This product open ing time is
48 hours at 25 °C , 55% Rh.
S est to print at the speed of 20-150 mm/s; D rawknife pressure is 3-4 N/cm ( Afer scraping,
sheet should be clean, and avoid produc ing wire drawing); the deviating speed from the sheet
is 0.1 3.0 mm/s.
N ot cured adhesive which is stick on li ne wires can be erased with a cetone or propylene
alcohol ethers .
please seal and chill when not us ing up the glue.