SMD LED patch potting and new materials

SMD LED patch potting and new materials
Model:HT-2050A/B
Brand:And the day
Origin:Made In China
Category:Chemicals / Adhesives & Sealants
Label: -
Price: -
Min. Order:2 pc

Product Description

Product Name: double group LED adhesive
Product model: HT-2050A/B
Product features:
High transmittance
Gao Chundu
This product contains special anti decay materials
- high strength adhesive, suitable for LED SMD chip package
Curing process
Curing, curing, no by-product precipitation.
- the platinum catalyzed hydrosilylation process
- addition reaction (double group)
Characteristics after curing
High optical transparency
High thermal conductivity and stability
1, application scope
This product is a high purity double component heat curing silicone material, which is used to improve the refractive index of the product, which has the characteristics of small shrinkage, high transmittance (>95%), PPA, metal and chip, etc., which is suitable for the manufacture of LED.
2, typical physical properties
Project
Numerical
Non curing property
Appearance
Transparent liquid
Group A 25 (mPa.s)
4100
Group B 25 (mPa.s)
2800
Mixed 25 (mPa.s)
3400
Post curing characteristics
Post curing state
Transparent rubber
Hardness (shore A)
~ 62
Use temperature (c)
50 ~ 250
Refractive index
More than 1 41
Transmittance% (wavelength 3mm 450nm thickness)
More than 95
Volume resistivity (CM)
> 1 * 1014
Dielectric constant
3 (60Hz)
Volume expansion coefficient PPM
295
Breakdown voltage (Kv/mm)
20 ~ 25
Bonding strength (PPA, MPa)
3.8
Tensile strength (MPa)
5.2
Ion content ppm
Na+
<0.2
K+
<0.6
Cl-
<0.5
3, the use of instructions
3.1 the substrate surface should be clean and dry. It can be heated to remove the moisture on the surface of the substrate; using naphtha, methyl ethyl ketoxime (MEK) or other suitable solvents to clean the substrate surface should not be use to the substrate in a dissolution or corrosion of the solvent, should not use the residual solvent.
3.2 in accordance with the recommended mix proportion - A:B = 1:1 (weight ratio), accurate weighing to clean glass containers, and fully mixed with the use of high speed mixing equipment, high speed mixing heat generated may make the temperature rise, thereby reducing the use of time.
3.3 the 10mmhg vacuum extrusion bubble. Before dispensing package material extrusion bubble. According to the need in the post allocation can also increase the bubble removal procedures.
3.4 to ensure the operability of the compound, A, B mix, please run out in 60 minutes.
3.5 curing conditions:
Heat to 80 degrees, bake for about 90 minutes, and then heat to 150 degrees, 180 minutes of baking.
4, product packaging
4.1 this product is divided into A, B double group of packaging.
4.2 the product is made of glass bottle packaging, specifications for the 500 grams per bottle packaging, a set of 1000 grams.
4.3 this product packaging marked name, brand name, batch number, weight, manufacturer, date of manufacture etc..
5, storage quality
5.1 this product please keep in the room temperature, avoids the sunlight, the ventilation is dry.
5.2 not used up the product should be re sealed to save, it is recommended to put into the glass drying box.
5.3 the preservation period of the product is 6 months from the date of making the home.
6, note
6.1 it is forbidden to mix B A into the bottle, because of the small amount of B glue can cause the phenomenon of A glue and knot!
6.2: certain materials, chemical agents, curing agents, and plasticizer can inhibit the curing of elastomeric materials:
1, organic tin and other organic metal compounds
2, sulfur, polysulfide, polysulfones or other sulfur containing items
3, amine, polyurethane rubber or containing ammonia
4, sub phosphorus or phosphorus containing items
5, some flux residues
If there is doubt about whether a certain type of substrate or material will inhibit the curing, it is s ested that a compatibility test should be done to test the suitability of a specific application. If there is a doubt that the substrate and the interface between the elastomer material is not compatible, it will inhibit the curing.
The above performance data is the typical data measured in the laboratory environment of the temperature 25, humidity 70%, only for the use of the reference, and can not guarantee the full data in a specific environment, please customers in the use of experimental data as the standard.

SMD LED patch potting and new materials 1SMD LED patch potting and new materials 2

Member Information

Dongguan city and new material limited company
Country/Region:Guang Dong - China
Business Nature:Manufacturer
Phone:13922932705
Contact:Liu Tao (Electronic commerce)
Last Online:21 Apr, 2016