The USB solution is designed for test, debug, validation, and programming of eMMC, eMCP devices

The USB solution provides a compact test solution for eMMC, eMCP devices used in applications such as handheld, mobile, and TV product development. 

Test, debug, validation, and programming of  eMMC, eMCP devices

Failure analysis / System and wafer test

Package and Chip qualification

Production prototype / Data recover

Feature:

Suitable for devices of  Samsung, Hynix, Sandisk, Toshiba, Intel, Kingston etc eMMC and eMCP.

Support eMMC version: ≤eMMC5.0.

Support hot plug, eMMC can be directly connected to PC with USB 3.0 port.

Realize reading, accessing and writting data for eMMC and eMCP devices

Specification:

Mechanical

Socket Body: PPS

Socket Lid: Aluminum Alloy

Contact: Spring Probe

Operation Temperature: 0ºC to 80ºC

Life Span at Operating Travel:50K Cycles min.

Cycles Spring Force:24.5gf per Pin

Electrical

Current Rating (Continuous) : 2A

DC Resistance: 100mohm