flip-chip bonding machinery

flip-chip bonding machinery
Model:RFM1180
Brand:cn
Origin:Made In China
Category:Industrial Supplies / Machinery / Hydraulic Pressure Machine & Parts
Label:FLIP-CHIP bonder , flip-chip bonding ma , RFID testing machine
Price: US $35000 / set
Min. Order:1 set

Product Description

Machine Structure:
1. Adhesive dispensing: it’s the same with RF1130, with fine adjustment in Z direction. Positioned by a CCD(CAM 1).
2.  Chip picking and pasting: Picking operation is the same as RF-1130, with fine adjustment in X, Y, Z three directions, can be revote in 360 degree in Z direction and with buffer device. Another CCD here is for the chip positioning.
3. Thermode: Both head of top and base thermode can be heated. Power source and controlling system is same as RF-1130. The position can be adjusted within 100mm to suit for different width of antenna.
4. Antenna feeding: Automatically feeding by stepping motor, positioned by sensor and precise positioned by CCD(CAM 1).
5. Antenna fixing device: There are vacuum holes on the fixing plate, through CCD( CAM1) to position.
Scheme Draft

flip-chip bonding machinery 1

Member Information

shenzhen CaiNa Semiconductor Equipment Co.,Ltd
Country/Region:Guang Dong - China
Business Nature:Manufacturer
Phone:18603071612
Contact:Joney (sales manager )
Last Online:11 May, 2016

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