RFID flip-chip bonder
| Model: | RFM500 |
|---|---|
| Brand: | caina |
| Origin: | Made In China |
| Category: | Industrial Supplies / Machinery / Hydraulic Pressure Machine & Parts |
| Label: | RFID bonder , flip-chip bonder , RFID testing machine |
| Price: |
US $20000
/ set
|
| Min. Order: | 1 set |
Product Description
http://www.chinarfid.biz/sell-3878455-rfid-flip-chip-bonding-machine-rfm500.html
Specifications:
Dimension: 620mm*650mm*680mm
Weight:75KG
Power:300W
Barometric Pressure: 5 bar≤P≤7 bar
Mechanical Controlling:Anisotropic electro-conductively paste,Manual material loading,Manual Focusing, Manual chip attaching,and transfer to hot-pressing.
Pressure Range;50-200g±1g
Work piece:Antenna≤100mm*80mm
Chipset 0.3mm*0.3mm-2mm*2mm
Video: One visual orientation system
Bonding Accuracy:±25um
Substrate Material:PET PVC PAPER
Glue Type:ACA NCA ICA
Member Information
| shenzhen CaiNa Semiconductor Equipment Co.,Ltd | |
|---|---|
| Country/Region: | Guang Dong - China |
| Business Nature: | Manufacturer |
| Phone: | 18603071612 |
| Contact: | Joney (sales manager ) |
| Last Online: | 11 May, 2016 |
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flip-chip bonding machinery
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