Model No.COB 3x3 for 5~6W

Made in Taiwan, ROC

Key Features

Al2O3-3x3 for 5~6W (pnl:116.6x57.15mm for 36pcs)

Size:12x12xt0.5mm with 0.7~0.8mm silicon cavity

Chips size: 24mil~35mil LED COB ceramic substrate Al2O3--3x3 for 9 die and 5~6Wt used Al2O3--5x5 for 25 die and 20 Wt used AlN--7x7 for 49 die and 50Wt used AlN 10x10 for 100 die and 100Wt used Ceramic metallized: Ti/W,gold(Au), sliver(Ag),Copper(Cu),nickel(Ni)¡Kothers & produce final circuit plating: 1um~150um Ceramic Metallized substrate: Al2O3 substrate metallized AlN substrate metallized Silicon wafer metallized LED heat-dissipation ceramic substrate: LED COB ceramic substrate LED Al2O3 thin film substrate LED Al2O3 thick film substrate LED AlN thin film heat-dissipation substrate Flip chip substrate: The integration of the thin film,thick film,electrode plating and electroless plating processes:

Application: 1. High Power LED ceramic substrate 2. Microwave (Wireless Communication & Radar) 3. Semiconductor Process Equipment 4. Solar Cell 5. Hybrid Electric Vehicles 6.Flip chip/eutectic substrate 7.Sensor ceramic substrate

Payment Terms: DA ,TT ,L/C