Key Features

Ceramic metallized: Ti/W,gold(Au), sliver(Ag),Copper(Cu),nickel(Ni)¡Kothers & produce final circuit

Coating:0.075um to 5mil

Ceramic Metallized substrate:

Al2O3 substrate metallized

AlN substrate metallized

Silicon wafer metallized

LED heat-dissipation ceramic substrate:

LED Al2O3 thin film substrate

LED Al2O3 thick film substrate

LED AlN thin film heat-dissipation substrate

Flip chip substrate

The integration of the thin film,thick film,electrode plating and electroless plating processes:

Application:

1. High Power LED ceramic substrate

2. Microwave (Wireless Communication & Radar)

3. Semiconductor Process Equipment

4. Solar Cell

5. Hybrid Electric Vehicles

6.Flip chip/eutectic substrate

7.Sensor ceramic substrate