Product Name

Nickel Chromium Sputtering Target

Element Symbol

Ni + Cr

Purity

3N, 3N6, 4N

Availble Shape

Planar target, Rotary target

Process

• Materials
• VIM
• Analysis
• Rolling
• Annealing
• Micrograph
• Machining
• Measurement
• Cleaning
• Inspection
• Package
• Shipping

Micrograph

The flexibility of our production process allows to adjust the microstructure of our coating material to achieve your desired effect. If the grains of the sputtering target are uniformly aligned, the user can benefit from constant erosion rates and homogeneous layers. The picture below are two micrographs of our Nickel Chromium (80/20 wt%) sputtering target, the average grain size＜100μm.
              
 








 

Analysis

The sputtering targets we produced are high purity, it’s most important benefits are that your films possess an outstanding level of electrical conductivity and minimized particle formation during the PVD process. Below form is a typically Certificate of analysis for 3N5 high purity Nickel Chromium (80/20 wt%) sputtering target.
Analytical Methods: 1. Metallic elements were analyzed using ICP-OES. 2. Gas elements were analyzed using LECO. 



Significantly, our plant is also specialized in manufacturing various Nickel based alloy sputtering targets, including Ni + Al, Ni + Co, Ni + Cu, Ni + W, Ni + Cr + Si, Ni + W + Cr alloy sputtering targets, with customized alloy compositions, flexible dimension with closer tolerance, as well as uniform microstructure. If any of our products are interesting to you, please contact us without hesitating.

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