Gold Electrode Thermistor Bare Chip

Application

1. Bonding(infrared thermal reactor,IGBT,thermal prnter head,integrated module,semiconductor module, power mould etc),tempeature sensor etc.

Feature

1.Adopt gold electrode,higher reliablity,gold/aluminum/silver wire bonding

2.Hihg accuracy,can reach ±0.3%，±1%，±3%

3.High stability&reliability

4.Small size, can be 0.3*0.3mm

5.Fast response

6. Customized size and parameters are available