With the development of electronic technologies, the heating of components has increasingly become a bottleneck of their functions and service life. With constant improvement of functional efficiency of electronic elements and constant decrease of their volumes, thermal management of electronic systems has encountered severe challenges. Insufficient heat dissipation will cause bad influences on the efficiency and reliability of semiconductors. More than a half of electronic elements going wrong are caused by excessive heat. Electronic elements mounted on substrates can dissipate heat effectively only by a heat sink effect, thus stabilizing the operating temperature.