Features

● Low profile package

● Ideal for automated placement

● Glass passivated chip junctions

● Fast switching for high efficiency

● High forward surge capability

● High temperature soldering： 260℃/10 seconds at terminals

● Component in accordance to RoHS 2002/95/1 and WEEE 2002/96/EC

Mechanical Date

● Case: JEDEC DO-214AA molded plastic body over glass passivated chip

● Terminals: Solder plated, solderable per J-STD-002B and JESD22-B102D

● Polarity:Laser band denotes cathode end