description: ceramics scribing with ultra-fast laser machine

the thickness of material: 1mm

Lasers can be used to scribe fine features in any material. This can be for surface patterning, dicing or as the first step in a "scribe and break" process.

Fine slots can be cut in almost any material including: ceramics, silicon, sapphire, metals and glass. These very fine slots can be used directly, as in the Laser Groove Buried Grid (LGBG) process in photovoltaic cell production.

to scribing, most materials under 1 mm thick can be  micro cut through using a laser. This eliminates the breaking step but obviously lengthens the process time. Hence laser micro-cutting is often used for dicing small batches while scribing is used for volume production.