Wafer bonding mirco cutting

Wafer bonding mirco cutting
Model:laser cutting
Brand:Deli
Origin:Made In China
Category:Services / Designing, Processing, Custom Made / Electronics Designing & Processing
Label:fine cutting , laser cutting , wafer cutting
Price: US $10 / pc
Min. Order:1 pc
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Product Description

 Laser cutting of Wafer bonding

0.5mmGlass + 0.24mmSilicon

 

1. High precision: Precise cutting for various precision part, arts and crafts. 
2. Small heat affected zone, good dimension stability. Smooth and beautiful cutting edges or surface do not need later processing. 
3. Higher cutting speed and low cost.

4 Almost all kinds of metals can be laser cut: mild steel, stainless steel and aluminum are the most common applications. Other laser cut parts are made from wood, plastics, glass and ceramics.

Laser cutting is a perfect match for working with a wide range of applications. High speed and clean edges are important for these applications. DeliLaser solutions offer a fast, safe, and easy way to cut with smooth and precise edges, even for the most complex shapes and sizes.

Wafer bonding mirco cutting 1

Member Information

Jiangyin Deli Laser Co., Ltd.
Country/Region:Jiang Su - China
Business Nature:Manufacturer
Phone:18606217115
Contact:David Kao (Sales Manager)
Last Online:18 Jul, 2019