The material is heat reinforced polymer, designed to meet the Thermal conductivity and reliability demand for the thermal conductivity of high application terminal. In addition, the heat sink’s performance benefits a lot from the low heat resistance. And improve the microprocessor, DC - DC converter of memory module and the reliability of power module. The phase change characteristics: the material is solid in room temperature and installation is completely convenient, used between heatsink and devices. The material can be softened and flowing when the products reach phase-change temperature to fill the devices’ tiny irregular contact surface. Thus, the material has the ability to fill the gap between the devices and heat sink completely, make the phase change better than non-current elastomers or thermal graphite pad and get the performance of thermal conductive silicon grease. The material is nonconductive, however, as the material has endured the phase change at high temperature, may make the metal get to the metal, so the phase change interface material cannot 

Features & Benefits: 

• Low heat resistance and low stress
• Natural sticky, easy to use-no need to use glue
• No radiator preheating
• Flow but not silicon oil
• Low volatility--less than 1%

• Physical Properties:

  Test Item	Unit	Test Result
  		LCM-A	LCM-B	LCM-P	LCM-Y
  Color	-	Gray	Black	Pink	Yellow
  Carrier	-	-	Aluminum foil	-	-
  Thermal Impedance	℃in2/w	0.035	0.03	0.05	0.05
  Thermal Conductivity Thermal Conductivity	W/m·K	2.5	2.5	1.0	1.0
  Phase Change Temp	℃	50～60	50～60	50～60	50～60
  Density	g/cm3	1.2	2.2	1.3	1.35
  Thickness	mm	0.13/0.2	0.18/0.25	0.13/0.2	0.13/0.2
  Storage Temp	℃	＜40	＜40	＜45	＜45
  Temperature range Temperature range	℃	-45～125	-45～125	-45～125	-45～125
  Storage Time	Month	12	24	12	12

  Specification: 200mm*400mm, 300mm*400mm；Customized size available

  For more , please kindly feel free to contact rita(at)szutd.com