BERGQUIST GAP PAD TGP HC5000 is  a soft and compliant gap filling material  with 

a thermal conductivity of 5.0 W/m-K.  The material offers exceptional thermal  performance 

at low pressures due to a  unique filler package and low-modulus resin  formulation. 

The enhanced material is ideal  for applications requiring low stress on  components 

and boards during assembly.  BERGQUIST GPHC5.0 maintains a conformable 

nature that  allows for excellent interfacing and wet-out  characteristics, even to surfaces with 

high  roughness and/or topography. BERGQUIST GAP PAD HC5.0 is  offered with 

natural inherent tack on both  sides of the material, eliminating the need  for thermally-impeding 

adhesive layers.  The top side has minimal tack for ease of  handling. BERGQUIST GAP PAD TGP  HC5000 

is supplied with protective liners on both sides.