Product Description

DB3050 is a two-component, low viscosity, room temperature curing modified epoxy resin adhesive-forms suitable adhesives between many different types of materials. The product has excellent temperature resistance and high storage stability. Typical application This product is suitable for normal temperature curing process, mainly used for potting of hydrogen energy fuel cell humidifiers, bonding, and reinforcing various substrates such as LCP and metal structure.

Typical use

For fuel cell system humidifier sealing applications