DB840B

The Underfill is a one-component epoxy sealant for CSP or BGA underfill  processes. It can form a consistent and non-defective underfill layer, which  can effectively reduce the impact caused by mismatching of overall  temperature expansion characteristics between the silicon chip and the  substrate or external forces. Fast curing when heated. The lower viscosity  characteristics allows for better underfilling; and good reworkability.