Purpose:

The high vacuum annealing furnace is used for alloy, oxidation, annealing, sintering, diffusion and other processes of 6-inch silicon wafers in large-scale integrated circuit and MEMS production lines. It can also be used for sinking processes to complete the corresponding processes of 4-inch wafers.
1、 Equipment structure:
1. Operation mode: Left (right) hand operation mode
2. Silicon wafer size: 6-inch circular wafer
3. Process layout: meet customer process requirements
4. Automation level: Industrial computer control system automatically controls the process flow
5. Delivery and pickup method: manual entry and exit of the boat.
6. Appearance: One main unit, with a horizontal two tube main frame.
2、 Main technical parameters:
1. Effective diameter of heating furnace tube: suitable for 6-inch silicon wafers. It is compatible with 5-inch and 4-inch silicon wafers downwards.
2. Working temperature range: 200~800 ℃
3. Constant temperature zone length and accuracy: 600mm,
4. Control mode: Unified process management by industrial computer

5. Vacuum degree: 2 * 10-4 Pa