The AW-1008  single-wafer photoresist asher is an automated tool designed as a flexible downstream Microwave plasma photoresist removal system for high-volume wafer fabrication.  The AW-1008 is in direct response to manufacturer’s concerns for wafer sensitivity to processing RF damage, uptime, reliability and production-proven technology.

AW-1008  Applications:

• Downstream ashing for NO device damage
• Frontside and backside isotropic removal
• Bulk resist removal
• Single wafer process
• High-dose implanted resist
• Non-oxidizing metal processing
• Descum  

AW-1008  Key Features:

• Production-proven plasma stripper/Asher system technology.
• 5-15% Uniformity. (Process & Hardware dependent.  Optional.)
• Fast strip/ash rate. (Process & Hardware dependent.  Optional.)
• Increased throughput with 3-Axis Integrated Robust Solid Robot.
• Frontside and backside isotropic removal.
• 3x 1kW IR Lamp for uniform heating up to 500C.
• 75mm-150mm wafer capability.
• Endpoint detection w/Allwin21 SLOPE technology (Optional)
• 2 wafer sizes capability without hardware change if necessary.
• Two Fixed cassette stations.  Or, one Fixed & one centering station.
• Can handle 50um thickness wafer
• PC controller with Advanced Allwin21 Software Package
• Up to 4 gas lines with MFC’s
• 2.45GHz 1000W Microwave
• Pressure control with Throttle Valve
• Touch screen monitor
• EMO, Interlocks, and Watchdog function
• GEM/SECS II interface, Optional
• Small Footprint
• Made in U.S.A.

AW-1008  Software Key Features:

• Real time graphics display, process data acquisition, and analysis.
• Closed-loop process parameters control.
• Precise parameters profiles tailored to suit specific process requirements.
• Programmable comprehensive calibration of all subsystems from within the software.  This allows faster, easier calibration, leading to enhanced process results.
• Recipe creation.  It features a recipe editor to create and edit recipes to fully automate the processing of wafers inside the process chamber.
• Validation of the recipe so improper control sequences will be revealed.
• Storage of multiple recipes, process data and calibration files so that process and calibration results can be maintained and compared over time.
• Passwords provide security for the system, recipe editing, diagnostics, calibration and setup functions
• Simple and easy to use menu screen which allow a process cycle to be easily defined and executed.
• Troubleshooting features which allows engineers and service personnel to activate individual subassemblies and functions. More I/O, AD/DA “exposure”.
• DB-25F parallel (printer) port.  The computer interfaces to the Allwin21 system with only one cable: the control interface cable.
• The control board inside the machine that translates the computer commands to control the machine has a watchdog timer.  If this board looses communication with the control software, it will shut down all processes and halt the system until communication is restored.
• GEM/SECS II function (Optional).
• Advanced Allwin21 EOP function (Optional).

AW-1008  Specifications:

• Wafer Size: 3 ,4,5,6 inch Capability. Multiple wafer size without hardware charge.
• Temperature: 150-350 ºC (±2 ºC) capability
• Gas Lines: Up to four gas lines with MFCs. Popular MFC Range: 510 SLM O2 and 1 SLM  N2.
• Asher Rate: 1.5u-5u/min. positive photoresist; >8u/min. negative photoresist
• Uniformity: 15%,  Process Dependent
• Particulate: <0.05 /cm2 (0.03um or greater)
• Damage: CV: <0.I V CV-shift for 250A gate oxide
• Selectivity: >1000:1
• MTBF/MTTA/MTTR: 450 Hours/100 Hours/3.5 Hours or Better. 95% uptime
• *Contact Allwin21 sales for other applications and specifications

AW-1008  Configuration:

• Main Frame with Breakers, Relays and Wires
• Pentium Class PC with AW Software
• Keyboard, Mouse, USB with SW backup and Cables
• Quartz Tray
  • ① 3-4 inch;  ② 4-6 inch; ③ 5 inch; ④ 6 inch; ⑤ Others
• Fixed Cassette Station
  • ① Two Cassette Stations;    ② One Cassette Station
• Lamp Heat Module and Quartz Window (3 of 1000W IR lamp)
• 6 inch Quartz showerhead and 5 inch Diffusion Disk
• Chamber Top Plate and Body with TC for Close Loop Temperature Control (CLTC)
• Main Control, Distributor PCB and DC
• H1-7X10.5 Integrated Solid Robot
• Waveguide and Quartz Plasma Tube
• Blower for Magnetron and Waveguide
• Capacitor, Two Transformers, HV Diode
• 1000W Air cooling magnetron
• 1-4 Gas Lines w/ Pneumatic Valve, and MFC
  • ① One MFC; ② Two MFCs; ③ Three MFCs; ④ Four MFCs
• AC Box and Lamp Control PCB for Close Loop Temperature Control (CLTC)
• Main Vacuum Valves. Two, one for  Fast and one for slow pump down
• MKS Baratron
• Throttle Valve
• Front EMO, Interlocks
• 15-inch Touch Screen GUI

AW-1008  Options:

• EOP Module with PCB
• GEM/SECS II function (Software)
• Lamp Tower Alarm  function
• 1.25kW “Absolute” MW Magnetron with water-cooled Waveguide with AGL Power Generator.
• Vacuum Pump

Keywords:Plasma Asher, Plasma Descum, Dry Clean, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment, Gasonics Aura 1000, Gasonics Aura 2000, Gasonics Aura 3000, Gasonics L3510, Gasonics Aura 3010