BGA Rework Station-SP360C

Specification:

PCB dimension: W50*50~400*420

PCB thickness: 0.5~3mm

Working  table adjustment :+/-50mm forward/backward ,+/-200mm left /right

Temperature control: K-type  thermocouple ,close cycle controlled

PCB locating way :outer

Upper heater:Hot gas,600w

Lower heater:Hot gas,800w

Bottom preheat: Far infrared.2400w

Power supply :Single -phase 220,50/60HZ,4KW

Machine dimension:L620*W580*H650

Machine weight: Approx.36kg

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Description

1.  High quality heating material produces high-tem breeze, precisely controlling the soldering and desoldering process.

2.  Movable heating head, able to move horizontally; easy to operate;

3.  Embedded industrial computer, touch screen interface, PLC control; real-time temperature curve display, able to display set curve and practically-tested curve; 7.2 high definition screen, convenient for operation and observation;

4.  Industrial computer able to store unlimited temperature curves, curve analysis can be done on touch screen; both English and Chinese can be input;

5.  The temperatures of the upper and lower heater can be precisely controlled according to set temperatures; bottom constant temperature infrared heating area; appropriate temperature control apparatus can ensure safe rework for BGA;

6.  The BGA soldering supporting frame can micro-adjusted to avoid local sinkage;

7.  Powerful cross flow can cool the lower heating area;

8.  The adjustable PCB positioning supports, easy and fast to install PCB; special fixture for installing allotype boards ;

9.  with sound alarming function after finishing soldering or desoldering; hand vacuum pen easy for picking up BGA;

10.  Set with over temperature alarming and protection function;

11.  Equipped with different hot gas nozzles, easy to replace; can be customized according to specific needs;

12.  integrated design of machine and chassis is room-saving.