Specifications:

PCB dimension: W20×20~W450×550mm 

PCB thinkness: 0.3~4mm
BGA dimension: 1mm×1mm~70mm×70mm
PCB locating way: Outer or Jig

Temperature control: K-type thermocouple, controlled
Lower hot-air heater: 600W                                    

Upper hot-air heater: 1000W     

Bottom IR heater: 3000W            Min pitch of BGA ball: 0.15mm

Placement precision:  0.01mm     Placement pressure: Min 20g

Max. BGA weight:  300g
Power supply: single-phase 220V,50/60Hz,

Gas supply: 0.5-0.8MPa,60L/min

Machine dimension: L1000×W900×H560mm  

Weight: Appox.  210KGS

------------------------------------------------------------------------------------------------------------------------------------BGA Rework Station

• Upper hot air heater head and mounting head are designed 2 in 1, have both the auto soldering and mounting function, auto memorize operating position;
• Upper heater has a special rapid cooling function toward BGA, meets lead free technology;
• X, Y, Z table are driven by serve motor, operated by rocker; can micro-adjust when getting close to the target point, Min resetting precision 0.01mm;
• Color optics alignment system with functions of split vision, zoom in/out and micro-adjust, equipped with aberration detection device; with auto focus and software operation function, 22 X optical focus, able to rework BGA sized up to 70×70mm;
• Suction nozzle can identify material and mounting height automatically, nozzle can be rotated 360°, and can control the gas pressure within a small range;
• Nitrogen can be used for protecting soldering & desoldering;
• Embedded industrial computer, touch screen interface, PLC control, real-time profile display, able to display set profile or 9 practically-tested profiles;
• 8 segments of temperature up(down) and 8 segments constant temperature control, no limited profiles are stored; profile analysis can be carried out on the touch screen; with computer communication function, communication software is attached;
• Three heaters(upper/lower hot air heater, bottom IR heater) heating independently, can rework BGA on any place of the PCB;
• Pick up BGA and move it to the place for solder automatically; drive BGA to destination after desolder automatically;
• Equipped with monitoring camera to observe the whole reworking process, balls melting status can be seen through the camera