KM1712HK-JSW two-component high-conductive silver adhesive
KTS International (HK) Ltd.
Silver plastic products is currently as follows:
High thermal conductivity Series: KM1901HK
The thermal conductivity Series: KM1612HK-JS KM1712HK-JSW
Low thermal conductivity Series: KM1012HK-JS
KM1712HK-JSW-component conductive silver glue
PRODUCT DESCRIPTION Product Description
KM1712HKA / B is an epoxy adhesive for electric connection
where room temperature cure is required.
It has following advantages.
KM1712HK A / B is a two-component room temperature curing epoxy conductive adhesive system.
KM1712HK A / B has the following advantages:
² Electrically conductive conductivity
² High thermal conductive high thermal conductivity
² Thixotropic thixotropy
² Ease of use is easy to use volume
² Good bond strength and good bonding
PROPERTIES OF UNCURED MATERIAL Uncured Material
Properties
Performance
Test Method
Test methods
Resin-A
-A epoxy resin
Hardener-B
Curing agent-B
Mixed-A / B
Mixture-A / B
Color / Appearance
Color / Appearance
Visual
Visual method
Silver
Silver
Silver
Silver
Silver
Silver
Specific Gravity, g/cm3 proportion
ASTM D-792
5.2
5.0
5.1
Viscosity @ 25 ° C, cps viscosity (25 ° C)
ASTM D-2393
Thixotropic
Thixotropic paste
Thixotropic
Thixotropic paste
Thixotropic
Thixotropic paste
TYPICAL CURED PROPERTIES Properties after curing
Cured 7 days @ 25 º C (77 º F) (cured seven days @ 25 º C)
Property Performance
numerical value
Flexural strength Flexural Strength, psi
10200
Tensile lap shear strength, psi @ 25 º C
1100
Thermal Conductivity Thermal conductivity, W / M-K
25
Max. Service temperature maximum operating temperature, º C
90
Min. Service temperature minimum operating temperature, º C
-40
Volume resistivity Volume resistivity, ohms-cm
0.0006
MIX RATIO mix
Resin / Hardener Ratio (by weight) weight ratio of resin and curing agent
100 / 100
Resin / Hardener Ratio (by volume) volume ratio of resin and curing agent
100 / 100
Pot Life (100 gram mass), 25 ° C, minutes operating time (100g) 25 ° C, minutes
60
CURING TIME TABLE curing schedule
Temperature Temperature
Minimum Cure Time minimum curing time
25 º C (77 º F)
16-24 hours
65 º C (149 º F)
3 hours
100 º C (212 º F)
45 minutes
SHELF METHOD preservation methods
Store at 25 º C in a dry place. After each use, tightly reseal. After each use, should be sealed and stored at 25 º C dry place.
SHELF LIFE Shelf Life
Provided this material is stored under the recommended storage conditions in their original containers,
it will remain in useable condition for half year from date of MADE.
Using the original packaging and stored at 15 - 30 º C dry place, shelf life of six months (from production date).
If you need more product information, please feel free to contact us.
