First, the introduction:

Two components of insulation packaging materials, has a low stress, excellent heat-proof impinge and stable electric performance, can be in room temperature or temperature curing. Heat resistant level already through the test (IEC 60216 / IEC60085).

Second, application: suitable for small and medium-sized electronic components potting, such as capacitor, ignition controller, filter, etc.

Third, the main index:

Test project testing method or conditions 4500 A (p3) 4500 B (p)

Appearance visual yellowish-brown liquid black or specified color viscous liquid

Viscosity 25 ℃, mPa • s 20 ± 10 2000-4000

Density 25 ℃, g/m1 1.2 + /-0.05 1.50 + /-0.05

Mixing proportion than 16-weight 0

Curing conditions ℃ / h 60/3 4 or 25/24

Hardness Shore-A, 25 º C 80 + 10

Volume resistivity (Ω • cm) 1014

Insulation intensity KV/mm > 20

Tensile strength Mpa > 3

Coefficient of thermal conductivity W/m • k acuity 0.67

Flame retardancy UL 94 V-0

Four, s est using process:

1, preheating: be pouring devices in 70 in please time integration C baking 1-2 hours, also can reduce temperature, extend the heating time, to remove device of moisture.

4500 A/B in the low temperature high viscosity, please preheat materials to 25 º C ~ 45 º C, easy to use.

2, B agent in the storage process will have statified or a small precipitation, please stir well after use.

3, mixed: according to the proportion weighing A, B, when stirred vertical stir bar, clockwise or anti-clockwise stir 2 ~ 3 minutes but, reduce stirred into the air, pay attention to the bottom of the container, the edge to mix the department also, otherwise, it will have not curing phenomenon.

4, TuoPao: for potting surface requirements bright and clean and no bubbles, who shall stir the mixture edge vacuum pumping edge (0.1 mpa) can be well off bubbles. The mechanical measuring mixing the pouring sealant can be omitted the 3, 4.

Pouring: will the mixture into the device, the device complicated structure, and great volume, duty to times pouring. Pouring hot air gun bubble can sweep can eliminate surface floating bubble.

6, cure: 25 º C / 24 h, or 60 º C / 3 h can be cured. Low temperature sall extend curing time. This product to moisture sensitive, moisture can cause curing sparkling. The operation environment s ested control in 23 ± 3 º C, relative humidity ﹤ 70%.