Model: | LP900 |
---|---|
Brand: | LTD |
Origin: | Made In China |
Category: | Electronics & Electricity / Other Electrical & Electronic |
Label: | ceramic plate |
Price: |
US $0.01
/ pc
|
Min. Order: | 1000 pc |
Last Online:23 Aug, 2019 |
LP900 is a silicon carbide ceramic heat sink and it belongs to the micro-hole structure. Under the same unit area,it can be more than 30% porosity, greatly increasing the heat transfer area with air to enhance its cooling effect. At the same time its heat capacity is small, its heat storage is small and the heat can be more quickly to the outside world. Ceramic heat sink main features: environmental protection, insulation resistance to high pressure, efficient heat, to avoid brewing EMI problems. So it can effectively solve the electronic and home appliance industry thermal and cooling problems, while it is specially for small and medium wattage power consumption, design space pay attention to light, thin, short, small products. What’s more, it can provide technical support
Features & Benefits:
The best electronic insulation and avoid the breeding of EMI problems Light weight book, high surface area, good heat radiation, no heat, heat fast Resistant to cold and heat shock, easy to install, no long-term preservation of the quality problem.
Typical applications:
LED: backlight module
TV: Thin LCD TV set top box
Network equipment: AP, Router, ADSL, Modern, S / W, STB Information Technology: M / B, NB, Video, Card
Memory: DDR3-DIMM, SO-DIMM, SSD
Power: Power module, power transistor
Physical Properties:
Test Item |
Unit |
Test Value |
Test Method |
Color |
- |
Green/Dark gray |
- |
Porosity |
% |
30 |
ASTM C 373 |
Water absorption |
% |
15.77 |
ASTM D 570-98 |
Mohs' hardness |
N/mm² |
5-6 |
DIN EN101-1992 |
Flexural strength |
kgf/cm² |
47.5 |
CNS12701(1990) |
Bulk density |
g/cm³ |
1.9 |
ASTM C 373 |
Resistance Insulation |
GΩ |
18 |
1000VDC,1minute |
Thermal Conductivity |
W/m·K |
9 |
HOT DISK |
Thermal Diffusivity |
mm²/s |
2.8 |
HOT DISK |
Maximum Operating Temperature |
℃ |
<700 |
- |
Dielectric Withstanding Voltage |
KV |
7 |
- |
Linear Thermal Expansion Coefficient |
10-6 |
4.13 |
ASTM C 372 |
Specific Heat |
MJ/m³K |
2.62 |
HOT DISK |
Main Composition |
SiC |
90%↑ |
- |
Size |
mm |
10×10/20×20/30×30/40×40/50×50/60×60 |
For more , please kindly feel free to contact rita(at)szutd.com