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 LP900 Ceramic Heat Sink 1 LP900 Ceramic Heat Sink 2
  •  LP900 Ceramic Heat Sink 1
  •  LP900 Ceramic Heat Sink 2

LP900 Ceramic Heat Sink

Model:LP900
Brand:LTD
Origin:Made In China
Category:Electronics & Electricity / Other Electrical & Electronic
Label:ceramic plate
Price: US $0.01 / pc
Min. Order:1000 pc
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Member Information

Detail

Product Description

LP900 is a silicon carbide ceramic heat sink and it belongs to the micro-hole structure. Under the same unit area,it can be more than 30% porosity, greatly increasing the heat transfer area with air to enhance its cooling effect. At the same time its heat capacity is small, its heat storage is small and the heat can be more quickly to the outside world. Ceramic heat sink main features: environmental protection, insulation resistance to high pressure, efficient heat, to avoid brewing EMI problems. So it can effectively solve the electronic and home appliance industry thermal and cooling problems, while it is specially for small and medium wattage power consumption, design space pay attention to light, thin, short, small products. What’s more, it can provide technical support 

Features & Benefits: 

The best electronic insulation and avoid the breeding of EMI problems Light weight book, high surface area, good heat radiation, no heat, heat fast Resistant to cold and heat shock, easy to install, no long-term preservation of the quality problem.

Typical applications: 

 

LED: backlight module

TV: Thin LCD TV set top box

Network equipment: AP, Router, ADSL, Modern, S / W, STB Information Technology: M / B, NB, Video, Card

Memory: DDR3-DIMM, SO-DIMM, SSD

Power: Power module, power transistor

 

Physical Properties:

Test Item

Unit

Test Value

Test Method

Color

-

Green/Dark gray

-

Porosity

%

30

ASTM C 373

Water absorption

%

15.77

ASTM D 570-98

Mohs' hardness

N/mm²

5-6

DIN EN101-1992

Flexural strength

kgf/cm²

47.5

CNS12701(1990)

Bulk density

g/cm³

1.9

ASTM C 373

Resistance Insulation

18

1000VDC,1minute

Thermal Conductivity

W/m·K

9

HOT DISK

Thermal Diffusivity

mm²/s

2.8

HOT DISK

Maximum Operating Temperature

<700

-

Dielectric Withstanding Voltage

KV

7

-

Linear Thermal Expansion Coefficient

10-6

4.13

ASTM C 372

Specific Heat

MJ/m³K

2.62

HOT DISK

Main Composition

SiC

90%↑

-

Size

mm

10×10/20×20/30×30/40×40/50×50/60×60

 

For more , please kindly feel free to contact rita(at)szutd.com


Product Image

 LP900 Ceramic Heat Sink 1
Img 1
 LP900 Ceramic Heat Sink 2
Img 2

Send Inquiry to this Member

Shenzhen Union Tenda Technology Co., Ltd

2/F, B1 Building, Maoyuan Industrial Park, Huanguan South Road, Guanlan Street, Longhua New Dist., Shenzhen, Guangdong, China (Mainland)

Phone:
13802-0-2279150
Fax:
Canad
Contact:
LTD13802279150 (Sales)
Mobile:
02279150

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