3D measurement of semiconductor chip solder BGA X-ray machine
Product Description
The HT series X-ray inspection equipment of HAOAO"s product is used to detect welding defects of BGA, CSP, flip chip, semiconductor and other electronic components.It is a high-resolution X-ray equipment. Itis used for the development of the SMT process and production process monitoring and rework stations
It uses the international manufacturing standards. It has excellent detection performance and
excellent value for money.It is a high-return investment.It is small and easy to move.It uses ergonomic design.It has a large detection range.It has.high-resolution dual mode detector.
It has Plane detector (option) and high magnification and versatile image analysis software
It has a simple operator interface
It uses the Windows XP operating system. It's easy to maintain and it is also simple to install
Product Image
Img 1
Send Inquiry to this Member
Related Products of this Company
This member assumes full responsibility for the content of this listing. DIYTrade accepts no responsibility whatsoever in respect of such content.
To report fraudulent or illegal content, please
click here.
China Suppliers Quick Searching:
,
