Hao Yang licensing paste is the modern printed circuit board level electronics assembly technology - surface mount technology is the most important connection material. The company has always been to open

Creating international brands paste as their responsibility, and conform to the new trend of the development of environmental protection, vigorously carry out systematic scientific research, sincerely for your dedication and self

The main brands of solder paste products and excellent technical services.

Lead-free solder paste alloy composition of Sn-3.5Ag \ Sn-0.7Cu \ Sn-Ag-Cu \ Sn-58Bi ( low temperature )

Have lead solder paste alloy composition of Sn63 / Pb37, Sn62 / Pb36 / Ag2, Sn43 / Pb43 / Bi14, Sn10 / Pb88 / Ag2

U flux type: disposable type solder paste, solder paste, water soluble rosin type solder paste

U basic concept and characteristic of solder paste

Solder paste is made up of solder alloy powder and flux / vector system in certain proportion mixed slurry solid;

Solder paste viscosity has rheological characteristics, namely, under the action of shear stress viscosity decreased in favor of printing, and printing viscosity recovery, resulting in a reflow soldering

Prior to fix the electronic components of the role;

In the process of reflow soldering of the solder alloy powder in the flux melting, removal of oxide film under the auxiliary function of wetting the component terminal and printed circuit

Road board pads metal surface and reaction between the two, eventually forming a mechanical and electrical connection.

The basic classification of u solder paste product

According to the solder alloy type, can be divided into lead and lead-free solder paste;

By cleaning method, can be divided into rosin-based solder paste, solder paste no-clean solder paste with water soluble;

According to the surfactant type, can be divided into pure rosin solder paste, solder paste, moderate activity rosin rosin activated radicals and organic based solder paste solder paste;

By applying method, can be divided into the template for printing solder paste, screen printing paste and infusion paste.

U solder paste development important process

The 1940's: printed circuit board assembly technology in the two World War and popularization;

The 1950's: tht group welding technology -- wave soldering technology;

1960's: for surface mount chip resistor capacitor components appear;

1971: Philips launched small outline integrated circuit, surface assembly concept established and rapidly spreading;

1985: the atmospheric ozone layer found empty;

1987:" Montreal Convention" sign, rosin-based solder paste cleaning solvent ---- chloride fluoride carbide using restricted and eventually banned

Check the use of. Water soluble solder paste no-clean concept and began to receive attention;

The 1990's: global warming, greenhouse effect has obvious;

2002: the" Kyoto Protocol" sign, requirements gradually reduced volatile organic substances using. Low VOC and VOC-Free solder paste begins with the concept of

Attention.

U solder paste save

Users received the company's solder paste immediately after the refrigerator, cold storage preservation in 3-7 DEG c.. Please note not to paste cold

Freeze preservation.

On the other hand, solder paste Kaifeng after use if there is surplus and hope in the next round of the assembly process continue to use instead of the waste, please again

Solder paste container seal, but can not be put into a refrigerator, and is placed in the room temperature.

U solder paste printing preparation

Solder paste inputs from the fridge, printing process must be done before the following 2 steps:

( 1) Kaifeng, at room temperature for at least 4-6 hours, so that the solder paste temperature natural pick up to room temperature.

( 2) the solder paste temperature up to room temperature, before printing in stirring to ensure, to paste the compositions of uniform distribution. S estion

Using a special stirring device, along the same direction mixing 1-3 minutes.

The principle of using U solder paste

FIFO, namely in the guarantee performance to meet the requirements of the premise, the first use of inventory for the longest time product.

The rest of the solder paste should be used before and the new paste by 1: 1 ratio of mixed use, but can not be completely using the" old" paste.

Related products:

63 / 37 ordinary solder paste solder paste containing silver solder paste lead-free solder paste

SMT high temperature solder paste special paste low temperature paste

For more details, please go to the company 's official website: http: / / gdtin.com: 0755--27759006 phone