錫球(錫粒)

型號：	HY199833
品牌：	浩洋錫業
原產地：	中國
類別：	電子、電力 / 電力配件與材料
標籤︰	錫球 , 錫粒
單價：	-
最少訂量：	1 件

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產品描述

產品說明：
公司生產的BGA封裝用焊接錫球，經過嚴密的品質監控，完全能符合客戶的生產品質要求。在科技電

子通訊快速的引導下，BGA的精密封裝方式，將促進產品達到更高效率、更高品質、更高產能之完整性，

尤其其具備較佳的散熱性，同時能使封裝產品薄型化，及縮小封裝區,且能縮短接合點距離以提高電子特

性。而且無需彎曲引腳，從而提升產品組裝之良率。

UCE錫球的品質優點
高真圓度單一球徑表面無缺陷高純度與高精度之成分控制產品無靜電高良率生產

錫球的合金成分與用途(成分規格書下載)
合金成分
熔點(℃)
球徑（mm）
用途

固相線
液相線

Sn63/Pb37 183 183 0．10~1.50 1. 半導體BGA封裝
2. SMT 接腳
3. 主機板焊錫用
4. 手提電腦
5. 通訊設備
6. 計算機主機板
7. LCD/PDA/DVD
8. 數位相機

Sn100 232 232 0．10~1.50
Sn96.5/Ag3.5 221 221 0．10~1.50
Sn96.5/Ag3/Cu0.5 217 217 0．10~1.50
Sn95.5/Ag4/Cu0.5 217 217 0．10~1.50
錫球的生產尺寸與包裝
球徑（mm）
公差（mm）
真圓度（mm）
粒（Kg） / 瓶

0．10
±0.010
＜0.008
50/100萬粒

0．20
±0.010
＜0.008
50/100萬粒

0.25
±0.010
＜0.008
50/100萬粒

0.30
±0.010
＜0.010
25/50/100萬粒

0.35
±0.010
＜0.010
25/50/100萬粒

0.40
±0.015
＜0.013
25/50萬粒

0.45
±0.015
＜0.013
25/50萬粒

0.50
±0.015
＜0.013
25萬粒

0.55
±0.015
＜0.015
25萬粒

0.60
±0.020
＜0.018
25萬粒

0.65
±0.020
＜0.018
25萬粒

0.76
±0.020
＜0.020
25萬粒

1．50
±0.050
＜0.040
0．5KG

浩洋錫業－浩洋牌焊錫、焊錫線、焊錫條、焊錫絲、無鉛焊錫、無鉛錫條、無鉛錫線，無鉛錫絲，無鉛焊

錫絲、無鉛助焊劑、無鉛錫膏、焊錫制品、環保焊錫、錫球(錫粒)、環保助焊劑、SMT焊錫膏、錫膏、助

焊劑、電鍍陽極板、錫球、錫錠、不鏽鋼焊錫絲、無鉛不鏽鋼焊錫絲、焊鋁錫絲、無鉛焊鋁錫絲、低溫焊

錫絲、無鉛低溫焊錫絲、高溫焊錫絲、無鉛高溫焊錫絲、焊鎳焊錫絲、無鉛焊鎳焊錫絲、焊錫技術、焊錫

廠、焊錫價格、焊錫爐、焊錫機械、焊錫設備

如需更多了解，請到公司官方網：http://gdtin.com 電話：0755--27759006

Product description:

The company production of BGA encapsulation welding solder balls, through strict quality control, can fully meet the customer's production and quality requirements. In the technology of electric

Sub communication quick guide, BGA precision encapsulation, will promote the product to achieve higher efficiency, higher quality, higher capacity of integrity,

In particular, it has the better heat dissipation, and can make packaging products is thin, and reduce the packaging area, and can shorten the distance to improve the joint point of electronic special

Sex. Without a bending pin assembly, so as to enhance the product yield.

UCE solder joints quality advantages

Gao Zhenyuan's single ball diameter surface defects of high purity and high precision of component control products without electrostatic high yield production

Solder alloy composition and use thereof ( component specification download )

Alloy composition

Melting point ( c )

Ball diameter ( mm )

Use

Solid line

Liquid phase

Sn63 / Pb37 1831830.10 ~ 1.501 BGA semiconductor package.

2 SMT pin

The 3 mainboard solder

4 laptop

The 5 communication device

The 6 host computer board

7 LCD / PDA / DVD

8 digital camera

Sn100 2322320.10 ~ 1.50

Sn96.5 / Ag3.5 2212210.10 ~ 1.50

Sn96.5 / Ag3 / Cu0.5 2172170.10 ~ 1.50

Sn95.5 / Ag4 / Cu0.5 2172170.10 ~ 1.50

Solder ball size of the production and packaging

Ball diameter ( mm )

Tolerance ( mm )

The roundness of ( mm )

Particle ( Kg ) / bottle

0.10

+ 0.010

< 0.008

50 / 1000000 particle

0.20

+ 0.010

< 0.008

50 / 1000000 particle

0.25

+ 0.010

< 0.008

50 / 1000000 particle

0.30

+ 0.010

< 0.010

25 / 50 / 1000000

0.35

+ 0.010

< 0.010

25 / 50 / 1000000

0.40

+ 0.015

< 0.013

25 / 500000 particle

0.45

+ 0.015

< 0.013

25 / 500000 particle

0.50

+ 0.015

< 0.013

250000 tablets

0.55

+ 0.015

< 0.015

250000 tablets

0.60

+ 0.020

< 0.018

250000 tablets

0.65

+ 0.020

< 0.018

250000 tablets

0.76

+ 0.020

< 0.020

250000 tablets

1.50

+ 0.050

< 0.040

0.5KG

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