KID-R 580 is an economical rework station (desoldering & soldering 2 in 1) controlled by software; it has optical alignment system moved by hand, and upper head driven by step motor; applicable to BGAs of all forms of encapsulation.
2. Features
n Hot air head and mounting head integration design, direct heating after mounting without moving PCB to avoid BGA misplaced, dual-speed motor drive, step motor precisely controls the upper head movement; with auto desoldering / soldering function;
n New-style hot air and IR mixed 2 in 1 for upper head heating; temperature rises fast, which leads to the big temperature difference between BGA and others around with no effects on them; suitable for PCB with small pitch between components.
n Three separate heating areas, upper/lower hot air and bottom IR; heating time and temperature can display on the touch screen.
n Large movable bottom pre-heating area, PCB clamping device can be flexibly adjusted on X/Y-axis; Applicable to Max. PCB size 550*500mm.
n Powerful cross flow fan cools down the lower heating areas quickly.
n Color high-resolution optical vision system with split vision, zoom in and fine-adjusting functions, aberration distinguish device included, auto-focus, software operation, 22x optical zoom, applicable to BGA size range 1 * 1-mm ~70*70mm.
n Embedded industrial computer, touch screen interface, PLC control with real-time temperature profile display; both setting profile and real temperature profile can be displayed;
n Inbuilt vacuum pump, rotatable 60° in Φ angle, fine-adjusting mounting suction nozzle.
n Upper/lower heater with 8 segments of temperature up (down) and 8 segments of constant temperature control, industrial computer can save temperature profiles without limit; can analysis profiles on the touch screen.
n Suction nozzle can detect mounting height automatically with pressure controllable within 10 grams.
n Many sizes of alloy nozzle, easy for replacement; can locate at all angle.
n Color optical vision system manually operated.
n Equipped with thermocouple port, real-time temperature monitoring and analyzing functions.
n With solid state running status display, to make temperature control safer and more reliable;
n Under different environment or in different areas, auto-generate standard SMT desoldering profiles; no need to set profiles and users with repair experience or not can operate it easily;
3. Technical parameter
n Model No: KD-R580
n Max. PCB size: W550*D500mm
n PCB thickness: 0.5~0.25mm
n BGA size: 1*1~0*70mm
n Min ball pitch: 0.15mm
n Max. weight of BGA: 150g
n Mounting accuracy: ±0.01mm
n PCB locating way: Outer
n Work table adjustable: forward/backward ±10mm,left/right±10mm
n Temperature control way: K-type thermocouple, close loop control
n Lower heater: hot air 800W
n Upper heater: IR + hot air 1200W
n Bottom pre-heating: IR 3600W
n Power: Single phase 220V, 50/60 Hz
n Machine size: L850*W750*H630mm
n Machine weight: Approx. 80KG